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1/15 not for new design july 2000 this is information on a product still in production but not recommended for new designs. m27v256 256 kbit (32kb x 8) low voltage uv eprom and otp eprom n m27v256 is replaced by the m27w256 n 3v to 3.6v low voltage in read operation n access time: 90ns n low power consumption: C active current 10ma at 5mhz C standby current 10a n programming voltage: 12.75v 0.25v n programming time: 100s/word n electronic signature C manufacturer code: 20h C device code: 8dh description the m27v256 is a low voltage 256 kbit eprom offered in the two ranges uv (ultra violet erase) and otp (one time programmable). it is ideally suited for microprocessor systems and is orga- nized as 32,768 by 8 bits. the m27v256 operates in the read mode with a supply voltage as low as 3v. the decrease in op- erating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. the fdip28w (window ceramic frit-seal package) has a transparent lid which allows the user to ex- pose the chip to ultraviolet light to erase the bit pat- tern. a new pattern can then be written to the device by following the programming procedure. for applications where the content is programmed only one time and erasure is not required, the m27v256 is offered in pdip28, plcc32 and tsop28 (8 x 13.4 mm) packages. figure 1. logic diagram ai01908 15 a0-a14 q0-q7 v pp v cc m27v256 g e v ss 8 1 28 28 1 fdip28w (f) pdip28 (b) plcc32 (k) tsop28 (n) 8 x 13.4mm obsolete product(s) - obsolete product(s)
m27v256 2/15 figure 2b. lcc connections ai01910 a13 a8 a10 q4 17 a0 nc q0 q1 q2 du q3 a6 a3 a2 a1 a5 a4 9 a14 a9 1 v pp a11 q6 a7 q7 32 du v cc m27v256 a12 nc q5 g e 25 v ss figure 2a. dip connections a1 a0 q0 a7 a4 a3 a2 a6 a5 a13 a10 a8 a9 q7 a14 a11 g e q5 q1 q2 q3 v ss q4 q6 a12 v pp v cc ai01909 m27v256 8 1 2 3 4 5 6 7 9 10 11 12 13 14 16 15 28 27 26 25 24 23 22 21 20 19 18 17 figure 2c. tsop connections a1 a0 q0 a5 a2 a4 a3 a9 a11 q7 a8 g e q5 q1 q2 q3 q4 q6 a13 a14 a12 a6 v pp v cc a7 ai01911 m27v256 28 1 22 78 14 15 21 v ss a10 table 1. signal names a0-a14 address inputs q0-q7 data outputs e chip enable g output enable v pp program supply v cc supply voltage v ss ground nc not connected internally du dont use obsolete product(s) - obsolete product(s)
3/15 m27v256 table 2. absolute maximum ratings (1) note: 1. except for the rating "operating temperature range", stresses above those listed in the table "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other condition s above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating condi - tions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant qual- ity documents. 2. minimum dc voltage on input or output is C0.5v with possible undershoot to C2.0v for a period less than 20ns. maximum dc voltage on output is v cc +0.5v with possible overshoot to v cc +2v for a period less than 20ns. 3. depends on range. table 3. operating modes note: x = v ih or v il , v id = 12v 0.5v. table 4. electronic signature symbol parameter value unit t a ambient operating temperature (3) C40 to 125 c t bias temperature under bias C50 to 125 c t stg storage temperature C65 to 150 c v io (2) input or output voltage (except a9) C2 to 7 v v cc supply voltage C2 to 7 v v a9 (2) a9 voltage C2 to 13.5 v v pp program supply voltage C2 to 14 v mode e g a9 v pp q7-q0 read v il v il x v cc data out output disable v il v ih x v cc hi-z program v il pulse v ih x v pp data in verify v ih v il x v pp data out program inhibit v ih v ih x v pp hi-z standby v ih xx v cc hi-z electronic signature v il v il v id v cc codes identifier a0 q7 q6 q5 q4 q3 q2 q1 q0 hex data manufacturers code v il 00100000 20h device code v ih 10001101 8dh obsolete product(s) - obsolete product(s)
m27v256 4/15 device operation the modes of operation of the m27v256 are listed in the operating modes. a single power supply is required in the read mode. all inputs are ttl lev- els except for v pp and 12v on a9 for electronic signature. read mode the m27v256 has two control functions, both of which must be logically active in order to obtain data at the outputs. chip enable (e ) is the power control and should be used for device selection. output enable (g ) is the output control and should be used to gate data to the output pins, indepen- dent of device selection. assuming that the ad- dresses are stable, the address access time (t avqv ) is equal to the delay from e to output (t elqv ). data is available at the output after delay of t glqv from the falling edge of g , assuming that e has been low and the addresses have been sta- ble for at least t avqv -t glqv . standby mode the m27v256 has a standby mode which reduces the supply current from 10ma to 10a with low voltage operation v cc 3.6v, see read mode dc characteristics table for details. the m27v256 is placed in the standby mode by applying a cmos high signal to the e input. when in the standby mode, the outputs are in a high impedance state, independent of the g input. table 5. ac measurement conditions high speed standard input rise and fall times 10ns 20ns input pulse voltages 0 to 3v 0.4v to 2.4v input and output timing ref. voltages 1.5v 0.8v and 2v figure 3. ac testing input output waveform ai01822 3v high speed 0v 1.5v 2.4v standard 0.4v 2.0v 0.8v figure 4. ac testing load circuit ai01823b 1.3v out c l c l = 30pf for high speed c l = 100pf for standard c l includes jig capacitance 3.3k w 1n914 device under test table 6. capacitance (1) (t a = 25 c, f = 1 mhz) note: 1. sampled only, not 100% tested. symbol parameter test condition min max unit c in input capacitance v in = 0v 6pf c out output capacitance v out = 0v 12 pf obsolete product(s) - obsolete product(s)
5/15 m27v256 table 7. read mode dc characteristics (1) (ta = 0 to 70c or C40 to 85c; v cc = 3.3v 10%; v pp = v cc ) note: 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. maximum dc voltage on output is v cc +0.5v. table 8a. read mode ac characteristics (1) (t a = 0 to 70 c or C40 to 85; v cc = 3.3v 10%; v pp = v cc ) note: 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. sampled only, not 100% tested. 3. speed obtained with high speed ac measurement conditions. symbol parameter test condition min max unit i li input leakage current 0v v in v cc 10 a i lo output leakage current 0v v out v cc 10 a i cc supply current e = v il , g = v il , i out = 0ma, f = 5mhz, v cc 3.6v 10 ma i cc1 supply current (standby) ttl e = v ih 1ma i cc2 supply current (standby) cmos e > v cc C 0.2v, v cc 3.6v 10 a i pp program current v pp = v cc 10 a v il input low voltage C0.3 0.8 v v ih (2) input high voltage 2 v cc + 1 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = C400a 2.4 v output high voltage cmos i oh = C100a v cc C 0.7v v symbol alt parameter test condition m27v256 unit -90 (3) -100 min max min max t avqv t acc address valid to output valid e = v il , g = v il 90 100 ns t elqv t ce chip enable low to output valid g = v il 90 100 ns t glqv t oe output enable low to output valid e = v il 40 45 ns t ehqz (2) t df chip enable high to output hi-z g = v il 0 25 0 30 ns t ghqz (2) t df output enable high to output hi-z e = v il 0 25 0 30 ns t axqx t oh address transition to output transition e = v il , g = v il 00ns two line output control because eproms are usually used in larger memory arrays, this product features a 2 line con- trol function which accommodates the use of mul- tiple memory connection. the two line control function allows: a. the lowest possible memory power dissipation, b. complete assurance that output bus contention will not occur. for the most efficient use of these two control lines, e should be decoded and used as the prima- ry device selecting function, while g should be made a common connection to all devices in the array and connected to the read line from the system control bus. this ensures that all deselect- ed memory devices are in their low power standby mode and hat the output pins are only active when data is desired from a particular memory device. obsolete product(s) - obsolete product(s)
m27v256 6/15 figure 5. read mode ac waveforms ai00758b taxqx tehqz a0-a14 e g q0-q7 tavqv tghqz tglqv telqv valid hi-z valid table 8b. read mode ac characteristics (1) (t a = 0 to 70c or C40 to 85 c; v cc = 3.3v 10%; v pp = vcc) note: 1. v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . 2. sampled only, not 100% tested. symbol alt parameter test condition m27v256 unit -120-150-200 min max min max min max t avqv t acc address valid to output valid e = v il , g = v il 120 150 200 ns t elqv t ce chip enable low to output valid g = v il 120 150 200 ns t glqv t oe output enable low to output valid e = v il 45 50 60 ns t ehqz (2) t df chip enable high to output hi-z g = v il 035040050ns t ghqz (2) t df output enable high to output hi-z e = v il 035040050ns t axqx t oh address transition to output transition e = v il , g = v il 000ns system considerations the power switching characteristics of advance cmos eproms require careful decoupling of the devices. the supply current, i cc , has three seg- ments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of e . the magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. the associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. it is recommended that a 0.1f ceram- ic capacitor be used on every device between v cc and v ss . this should be a high frequency capaci- tor of low inherent inductance and should be placed as close to the device as possible. in addi- tion, a 4.7f bulk electrolytic capacitor should be used between v cc and v ss for every eight devic- es. the bulk capacitor should be located near the power supply connection point. the purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of pcb traces. obsolete product(s) - obsolete product(s)
7/15 m27v256 table 9. programming mode dc characteristics (1) (t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v) note: v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . table 10. programming mode ac characteristics (1) (t a = 25 c; v cc = 6.25v 0.25v; v pp = 12.75v 0.25v note: v cc must be applied simultaneously with or before v pp and removed simultaneously or after v pp . symbol parameter test condition min max unit i li input leakage current v il v in v ih 10 a i cc supply current 50 ma i pp program current e = v il 50 ma v il input low voltage C0.3 0.8 v v ih input high voltage 2 v cc + 0.5 v v ol output low voltage i ol = 2.1ma 0.4 v v oh output high voltage ttl i oh = C1ma 3.6 v v id a9 voltage 11.5 12.5 v symbol alt parameter test condition min max unit t avel t as address valid to chip enable low 2 s t qvel t ds input valid to chip enable low 2 s t vphel t vps v pp high to chip enable low 2s t vchel t vcs v cc high to chip enable low 2s t eleh t pw chip enable program pulse width 95 105 s t ehqx t dh chip enable high to input transition 2 s t qxgl t oes input transition to output enable low 2 s t glqv t oe output enable low to output valid 100 ns t ghqz t dfp output enable high to output hi-z 0 130 ns t ghax t ah output enable high to address transition 0ns programming the m27v256 has been designed to be fully com- patible with the m27c256b and has the same electronic signature. as a result the m27v256 can be programmed as the m27c256b on the same programming equipments applying 12.75v on v pp and 6.25v on v cc by the use of the same pres- to ii algorithm. when delivered (and after each erasure for uv eprom), all bits of the m27v256 are in the '1' state. data is introduced by selective- ly programming '0's into the desired bit locations. although only '0's will be programmed, both '1's and '0's can be present in the data word. the only way to change a '0' to a '1' is by die exposure to ul- traviolet light (uv eprom). the m27v256 is in the programming mode when v pp input is at 12.75v, g is at v ih and e is pulsed to v il . the data to be programmed is applied to 8 bits in parallel to the data output pins. the levels required for the ad- dress and data inputs are ttl. v cc is specified to be 6.25 v 0.25 v. obsolete product(s) - obsolete product(s)
m27v256 8/15 presto ii programming algorithm presto ii programming algorithm allows to pro- gram the whole array with a guaranteed margin, in a typical time of 3.5 seconds. programming with presto ii involves the application of a sequence of 100s program pulses to each byte until a cor- rect verify occurs (see figure 7). during program- ming and verify operation, a margin mode circuit is automatically activated in order to guar- antee that each cell is programmed with enough margin. no overprogram pulse is applied since the verify in margin mode at v cc much higher than 3.6v provides necessary margin to each pro- grammed cell. program inhibit programming of multiple m27v256s in parallel with different data is also easily accomplished. ex- cept for e , all like inputs including g of the parallel m27v256 may be common. a ttl low level pulse applied to a m27v256's e input, with v pp at 12.75 v, will program that m27v256. a high level e input inhibits the other m27v256s from being pro- grammed. program verify a verify (read) should be performed on the pro- grammed bits to determine that they were correct- ly programmed. the verify is accomplished with g at v il , e at v ih , v pp at 12.75v and v cc at 6.25v. figure 6. programming and verify modes ac waveforms tavel valid ai00759 a0-a14 q0-q7 v pp v cc g data in data out e tqvel tvphel tvchel tehqx teleh tglqv tqxgl tghqz tghax program verify figure 7. programming flowchart ai02677 n = 0 last addr verify e = 100 m s pulse ++n = 25 ++ addr v cc = 6.25v, v pp = 12.75v fail check all bytes 1st: v cc = 5v 2nd: v cc = 3v yes no yes no yes no obsolete product(s) - obsolete product(s)
9/15 m27v256 electronic signature the electronic signature (es) mode allows the reading out of a binary code from an eprom that will identify its manufacturer and type. this mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. the es mode is functional in the 25c 5c am- bient temperature range that is required when pro- gramming the m27v256. to activate the es mode, the programming equipment must force 11.5v to 12.5v on address line a9 of the m27v256, with v cc = v pp = 5v. two identifier bytes may then be sequenced from the device outputs by toggling ad- dress line a0 from v il to v ih . all other address lines must be held at v il during electronic signa- ture mode. byte 0 (a0 = v il ) represents the man- ufacturer code and byte 1 (a0 = v ih ) the device identifier code. for the stmicroelectronics m27v256, these two identifier bytes are given in table 4 and can be read-out on outputs q7 to q0. note that the m27v256 and m27c256b have the same identifier bytes. erasure operation (applies for uv eprom) the erasure characteristics of the m27v256 is such that erasure begins when the cells are ex- posed to light with wavelengths shorter than ap- proximately 4000 ?. it should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 ? range. research shows that constant exposure to room level fluo- rescent lighting could erase a typical m27v256 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. if the m27v256 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the m27v256 window to prevent unintentional era- sure. the recommended erasure procedure for the m27v256 is exposure to short wave ultraviolet light which has wavelength 2537?. the integrated dose (i.e. uv intensity x exposure time) for erasure should be a minimum of 15 w-sec/cm 2 . the era- sure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 w/cm 2 power rating. the m27v256 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. some lamps have a filter on their tubes which should be removed before era- sure. obsolete product(s) - obsolete product(s)
m27v256 10/15 table 11. ordering information scheme note: 1. high speed, see ac characteristics section for further information. m27v256 is replaced by the m27w256 for a list of available options (speed, package, etc...) or for further information on any aspect of this de- vice, please contact the stmicroelectronics sales office nearest to you. example: m27v256 -90 k 1 tr device type m27 supply voltage v = 3v to 3.6v device function 256 = 256 kbit (32kb x 8) speed -90 (1) = 90 ns -100 = 100 ns -120 = 120 ns -150 = 150 ns -200 = 200 ns package f = fdip28w b = pdip28 k = plcc32 n = tsop28: 8 x 13.4 mm temperature range 1 = 0 to 70 c 6 = C40 to 85 c options tr = tape & reel packing obsolete product(s) - obsolete product(s)
11/15 m27v256 table 12. fdip28w - 28 pin ceramic frit-seal dip, with window, package mechanical data symb mm inches typ min max typ min max a 5.72 0.225 a1 0.51 1.40 0.020 0.055 a2 3.91 4.57 0.154 0.180 a3 3.89 4.50 0.153 0.177 b 0.41 0.56 0.016 0.022 b1 1.45 C C 0.057 C C c 0.23 0.30 0.009 0.012 d 36.50 37.34 1.437 1.470 d2 33.02 C C 1.300 C C e 15.24 C C 0.600 C C e1 13.06 13.36 0.514 0.526 e 2.54 C C 0.100 C C ea 14.99 C C 0.590 C C eb 16.18 18.03 0.637 0.710 l 3.18 0.125 s 1.52 2.49 0.060 0.098 ? 7.11 C C 0.280 C C a 4 11 4 11 n 28 28 figure 8. fdip28w - 28 pin ceramic frit-seal dip, with window, package outline drawing is not to scale. fdipw-a a3 a1 a l b1 b e d s e1 e n 1 c a ea d2 ? eb a2 obsolete product(s) - obsolete product(s)
m27v256 12/15 table 13. pdip28 - 28 pin plastic dip, 600 mils width, package mechanical data symb mm inches typ min max typ min max a C 5.08 C 0.200 a1 0.38 C 0.015 C a2 3.56 4.06 0.140 0.160 b 0.38 0.51 0.015 0.020 b1 1.52 C C 0.060 C C c 0.20 0.30 0.008 0.012 d 36.83 37.34 1.450 1.470 d2 33.02 C C 1.300 C C e 15.24 C C 0.600 C C e1 13.59 13.84 0.535 0.545 e1 2.54 C C 0.100 C C ea 14.99 C C 0.590 C C eb 15.24 17.78 0.600 0.700 l 3.18 3.43 0.125 0.135 s 1.78 2.08 0.070 0.082 a 0 10 0 10 n 28 28 figure 9. pdip28 - 28 pin plastic dip, 600 mils width, package outline drawing is not to scale. pdip a2 a1 a l b1 b e1 d s e1 e n 1 c a ea eb d2 obsolete product(s) - obsolete product(s)
13/15 m27v256 table 14. plcc32 - 32 lead plastic leaded chip carrier, package mechanical data symb mm inches typ min max typ min max a 2.54 3.56 0.100 0.140 a1 1.52 2.41 0.060 0.095 a2 0.38 C 0.015 C b 0.33 0.53 0.013 0.021 b1 0.66 0.81 0.026 0.032 d 12.32 12.57 0.485 0.495 d1 11.35 11.56 0.447 0.455 d2 9.91 10.92 0.390 0.430 e 14.86 15.11 0.585 0.595 e1 13.89 14.10 0.547 0.555 e2 12.45 13.46 0.490 0.530 e 1.27 C C 0.050 C C f 0.00 0.25 0.000 0.010 r 0.89 C C 0.035 C C n32 32 nd 7 7 ne 9 9 cp 0.10 0.004 figure 10. plcc32 - 32 lead plastic leaded chip carrier, package outline drawing is not to scale. plcc d ne e1 e 1 n d1 nd cp b d2/e2 e b1 a1 a r 0.51 (.020) 1.14 (.045) f a2 obsolete product(s) - obsolete product(s)
m27v256 14/15 figure 11. tsop28 - 28 lead plastic thin small outline, 8 x 13.4 mm, package outline drawing is not to scale tsop-c d1 e 7 8 cp b e a2 a 22 d die c l a1 a 21 28 1 table 15. tsop28 - 28 lead plastic thin small outline, 8 x 13.4 mm, package mechanical data symbol mm inch typ min max typ min max a 1.250 0.0492 a1 0.200 0.0079 a2 0.950 1.150 0.0374 0.0453 b 0.170 0.270 0.0067 0.0106 c 0.100 0.210 0.0039 0.0083 d 13.200 13.600 0.5197 0.5354 d1 11.700 11.900 0.4606 0.4685 e 0.550 C C 0.0217 C C e 7.900 8.100 0.3110 0.3189 l 0.500 0.700 0.0197 0.0276 a 0 5 0 5 cp 0.100 0.0039 n28 28 obsolete product(s) - obsolete product(s)
15/15 m27v256 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is registered trademark of stmicroelectronics a 2000 stmicroelectronics - all rights reserved all other names are the property of their respective owners. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com obsolete product(s) - obsolete product(s)

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